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General Job Scope:
Failure Analysis capability on semiconductor package level and die level
Reliability capability on semiconductor Assembly process, especially on qualification process
Requirements:
Bachelor Degree or above, major in Microelectronics or Semiconductor Material or Condensed Matter Physics preferred
Good knowledge on semiconductor, better in GaAs HBT study, FA instrument (especially on curve tracer, c-sam and SEM).
Semiconductor Industry internship experience preferrd
Familiarity with the following equipment an advantage
Optical microscope(max:4000x) / Smart scope(x,y,z dimension) / X-Ray / C-SAM / X-section & polishing / Decap / Curve tracer / Probe station & Laser cutter / SEM (scanned electron microscope)+ EDX |
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